TSMC would launch the manufacture of chips engraved in 3 nm this week

TSMC would launch the manufacture of chips engraved in 3 nm this week

TSMC’s first 3nm chips would go into production this week. A report of DigiTimes indicates that the kick-off will be launched on December 29: the company should organize a ceremony at the Southern Taiwan Science Park. The foundry should detail its plans to expand the production of 3 nm chips.

A TSMC factory in Taiwan.

The question now is whether the future M2 Pro chip (which we expect to see in the next MacBook Pros) will take advantage of this new burning process. In the month of June, Digitimes affirmed that the first generation of M2 Pro processors as well as the M3 would benefit from it. Opposite, analyst Ming-Chi Kuo estimated rather than future MacBook Pros would still have a chip engraved in 5 nm.

TSMC explains that burning in 3 nm (N3) should bring a performance gain of 10 to 15% at equal consumption or a reduction in consumption of 25 to 30% at equal performance compared to burning in 5 nm. More transistors will fit in the same space, which means logic density will be reduced by 42%.

It is expected that the M2 Pro chips will eventually be integrated into revised versions of the Mac mini and Mac Studio. In September, Nikkei Asia affirmed that the M3 SoC generation of Macs would transition to N3E etching, an advanced process that further improves performance.